Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling - Archive ouverte HAL Access content directly
Journal Articles Microelectronics Reliability Year : 2019

Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling

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hal-02382376 , version 1 (27-11-2019)

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Yousra Bettahi, Caroline Richard. Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling. Microelectronics Reliability, 2019, 92, pp.20-26. ⟨10.1016/j.microrel.2018.11.005⟩. ⟨hal-02382376⟩
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