Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling

Yousra Bettahi; Caroline Richard

doi:10.1016/j.microrel.2018.11.005

Journal articles

Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling

Yousra Bettahi Caroline Richard ¹

1 GREMAN - UMR 7347 - GREMAN (matériaux, microélectronique, acoustique et nanotechnologies)

Document type :

Journal articles

Domain :

Physics [physics] / Mechanics [physics] / Acoustics [physics.class-ph]

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https://hal-univ-tours.archives-ouvertes.fr/hal-02382376
Contributor : Catherine Chenu <>
Submitted on : Wednesday, November 27, 2019 - 10:44:01 AM
Last modification on : Thursday, November 28, 2019 - 1:41:10 AM

Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling

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Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling

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