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Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling

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https://hal-univ-tours.archives-ouvertes.fr/hal-02382376
Contributor : Catherine Chenu <>
Submitted on : Wednesday, November 27, 2019 - 10:44:01 AM
Last modification on : Thursday, November 28, 2019 - 1:41:10 AM

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Yousra Bettahi, Caroline Richard. Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling. Microelectronics Reliability, Elsevier, 2019, 92, pp.20-26. ⟨10.1016/j.microrel.2018.11.005⟩. ⟨hal-02382376⟩

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