Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling

Yousra Bettahi; Caroline Richard

doi:10.1016/j.microrel.2018.11.005

Journal Articles Microelectronics Reliability Year : 2019

Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling

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1

Yousra Bettahi

Function : Author

Caroline Richard

Function : Author
PersonId : 20902
IdHAL : caroline-richard
ORCID : 0000-0002-8375-8241
IdRef : 060373172

GREMAN (matériaux, microélectronique, acoustique et nanotechnologies)

CV

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Physics [physics] Mechanics [physics] Acoustics [physics.class-ph]

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https://hal-univ-tours.archives-ouvertes.fr/hal-02382376

Submitted on : Wednesday, November 27, 2019-10:44:01 AM

Last modification on : Wednesday, February 8, 2023-5:11:10 PM

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hal-02382376 , version 1 (27-11-2019)

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HAL Id : hal-02382376 , version 1
DOI : 10.1016/j.microrel.2018.11.005

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Yousra Bettahi, Caroline Richard. Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling. Microelectronics Reliability, 2019, 92, pp.20-26. ⟨10.1016/j.microrel.2018.11.005⟩. ⟨hal-02382376⟩

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Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling

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