Yousra Bettahi, Caroline Richard. Evolution of microstructure of Lead free cu/Sn solders and copper oxide phase precipitation in Cu3Sn intermetallic during thermal cycling.
Microelectronics Reliability, Elsevier, 2019, 92, pp.20-26.
⟨10.1016/j.microrel.2018.11.005⟩.
⟨hal-02382376⟩