Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity

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Submitted on : Tuesday, August 14, 2018 - 8:26:20 AM
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T. Youssef, W. Rmili, E. Woirgard, S. Azzopardi, N. Vivet, et al.. Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity. Microelectronics Reliability, Elsevier, 2015, 55 (9-10), pp.1997 - 2002. ⟨10.1016/j.microrel.2015.06.085⟩. ⟨hal-01857025⟩

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