Influence of Bonding Delaminations on The Electromechanical Admittance (EMA) of a Single-element Piezoelectric Transducer

Wenxiang Ding , Maxime Bavencoffe (1) , Marc Lethiecq (1)

1 GREMAN - UMR 7347 - GREMAN (matériaux, microélectronique, acoustique et nanotechnologies)

The transducer is an essential part of all ultrasonic systems used for applications such as medical diagnostics, therapy, nondestructive evaluation, cleaning or other purposes because its health condition is vital to their proper operation. Defects within the active element, backing or other constitutive elements, loss of adhesion between layers can significantly weaken the performance of a transducer. The objective of this work is to determine procedures to monitor the behavior of a single-element probe during its lifetime and detect degradations before they significantly affect the performance of the system. To achieve this, electromechanical admittance-based (EMA-based) method is envisaged numerically and experimentally. A simplified single-element transducer consisting of a piezoceramic disk, a bonding layer and a backing is studied and the influence of bonding delamination on EMA is investigated. This study considers three different types of delaminations, which are named respectively ?center? (circular delamination from the center of the disc towards the peripheric zone), ?peripheric? (annular delamination from the peripheric zone towards the center) and ?wedge? (delamination from the center to the outside with a given angle). First, a numerical model based on the finite element method is developed. A two-dimensional (2D) finite element analysis is implemented for the first two types of delaminations, taking advantage of their axisymmetric structure, and ?wedge? delamination is modeled in three dimensions (3D). Secondly, transducers with different shapes of 3D printed backings are mounted and experiments are conducted using an impedance analyzer. Experimental results are found to be in good agreement with numerical solutions and it is shown that changes in EMA could allow early detection of delaminations in an ultrasound probe.

Mots clés: ultrasonic transducer; bonding delamination; admittance characterization; finite element method

Domaines: Acoustique [physics.class-ph]; Vibrations [physics.class-ph]

Wenxiang Ding, Maxime Bavencoffe, Marc Lethiecq. Influence of Bonding Delaminations on The Electromechanical Admittance (EMA) of a Single-element Piezoelectric Transducer. Forum Acusticum, Dec 2020, Lyon, France. pp.2857-2862, ⟨10.48465/fa.2020.0479⟩. ⟨hal-03240269⟩